Refroid Technologies and Technavious Solutions Private Limited partner to build sovereign liquid cooling infrastructure for India’s AI Data Centres

Refroid Technologies and Technavious Solutions Private Limited partner to build sovereign liquid cooling infrastructure for India’s AI Data Centres

HYDERABAD, India, March 13, 2026 /PRNewswire/ -- Refroid Technologies, India’s pioneer in indigenous high-density liquid cooling, and Technavious Solutions Private Limited, a global mission-critical data centre engineering, commissioning, and certification firm, today announced a strategic partnership to deliver a validated “Brick-to-Chip” infrastructure framework for AI-ready data centres.

As AI workloads push compute densities to unprecedented levels, traditional air-cooled facilities are approaching their thermal limits. Next-generation processors are now exceeding 500W thermal design power (TDP), forcing operators to rethink how infrastructure is designed, cooled, and validated. The Refroid–Technavious alliance addresses this challenge by combining Refroid’s advanced liquid cooling technologies with Technavious’s specialised MEP (Mechanical, Electrical and Plumbing) design, commissioning and TIA-942 certification expertise.

Bridging the Hardware-Infrastructure Engineering Gap

● The partnership provides a comprehensive infrastructure roadmap across two distinct technical tracksHyperscale DLC Integration: Technavious will integrate Refroid’s Sentraflo Coolant Distribution Units (CDUs) into hyperscale facility blueprints. This ensures that secondary liquid loops are engineered for optimal flow stability, thermal efficiency, and redundancy. This enables data centres to support large-scale GPU clusters while maintaining the reliability standards required for hyperscale AI infrastructure.

● Sovereign Immersion for Enterprise Edge: For captive data centres and remote edge nodes, the partnership offers self-contained Liquid Immersion Cooling Pods. Technavious provides the site-readiness engineering to deploy these systems within existing facilities, enabling high-density AI compute without expensive facility retrofits.

Solving the “Commissioning Gap”