Exclusive-ASML plots future of chipmaking tools for AI beyond EUV

SAN JOSE, California, March 2 : ASML Holding has ambitious plans to expand its line of chipmaking equipment into several new products to capture more of the rapidly growing market for artificial intelligence chips, a senior executive told Reuters. More than a decade in development, ASML is the only maker of

SAN JOSE, California, March 2 : ASML Holding has ambitious plans to expand its line of chipmaking equipment into several new products to capture more of the rapidly growing market for artificial intelligence chips, a senior executive told Reuters. 

More than a decade in development, ASML is the only maker of extreme ultraviolet, or EUV, equipment, which is crucial for Taiwan Semiconductor Manufacturing Co and Intel in manufacturing the world's most advanced AI chips. ASML has poured billions of dollars into developing the EUV systems, has a next-generation product nearing production and is researching a third potential generation.

The Dutch company is looking to grow beyond its EUV roots and plans to expand into the market to make tools that can help glue and connect multiple specialized chips, called advanced packaging - a key building block for AI chips and the advanced memory that feeds them. As part of those plans, the company will deploy AI in its forthcoming businesses and legacy efforts.

"We look, not just for the next five years, we look at the next 10, maybe 15 years," ASML Chief Technology Officer Marco Pieters told Reuters. "(We look at) what are potential directions the industry could take, and what would it require in terms of packaging, bonding, etc.?"