Canada and IBM to publish chips pact amid Biden-Trudeau visit
BNN Bloomberg
Canada and International Business Machines Corp. will publish a high-level agreement on expanding semiconductor cooperation on Friday, during U.S. President Joe Biden’s visit to Ottawa.
The memorandum of understanding will seek to capitalize on the U.S. push for semiconductor investment with its CHIPS Act, according to a government official familiar with the matter. The document will likely be released after Biden and Canadian Prime Minister Justin Trudeau hold their bilateral meeting Friday morning.
IBM already operates a large facility for testing and packaging semiconductors in Bromont, Quebec, less than an hour north of the U.S. border.
The agreement will lay out a plan to further build out the microchip ecosystem in the region, particularly when it comes to workforce development. It will also pledge to look at increasing Canada’s role in the semiconductor supply chain and integrating it with U.S. manufacturing.
